The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 1994
Filed:
Nov. 12, 1992
Applicant:
Inventors:
Yoshinao Ohnuma, Nara, JP;
Yasunobu Tagusa, Ikoma, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
445 24 ; 26427217 ; 29841 ;
Abstract
A method for mounting a semiconductor chip on a first wire board, bonding a second wire board to a connecting terminal of the first wire board with a thermo-setting layer of anisotropic conductivity, covering the undersurface and periphery of the semiconductor chip by a first thermo-setting epoxy resin so as to embed and seal the semiconductor chip therein, and cover the connecting part of the first wire board and the second wire board by a second thermo-setting epoxy resin.