The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 1994
Filed:
Jul. 21, 1992
Takao Yoneyama, Gifu, JP;
Katsuhiro Izuchi, Anjo, JP;
Nippondenso Co., Ltd., Kariya, JP;
Abstract
A fluxless soldering process comprising the steps of: preparing first and second members to be bonded by soldering, the first member having a bonding surface with a higher solder-wettability and the second member having a bonding surface with a lower solder-wettability; placing the second member with the bonding surface thereof facing upward, a solder foil on the bonding surface of the second member, and the first member on the solder foil and with the bonding surface thereof facing downward, to form an assembly; heating the assembly in a reducing atmosphere to fuse the solder foil, thereby forming a molten solder between the first and second members; and cooling the assembly to solidify the molten solder, thereby bonding the first and second members.