The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 1994
Filed:
Jan. 02, 1992
Applicant:
Inventor:
Yu-Tsai Chen, Glen Ellyn, IL (US);
Assignee:
Amoco Corporation, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
524606 ; 524 35 ; 524607 ; 528338 ; 528339 ; 528340 ; 528344 ; 528347 ;
Abstract
Fiber- or particulate-filled polyphthalamide molding compositions, wherein the polyphthalamide comprises recurring units obtainable from terephthalic acid, 2,6-naphthalene dicarboxylic acid, aliphatic diamine and, optionally, isophthalic acid, exhibit a desirable combination of thermal, mechanical and solvent resistance properties.
Chen, Yu-Tsai. (1994). Filled molding composition comprising polyamide having terephthalamide (U.S. Patent No. 5288793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5288793
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile