The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 1994
Filed:
May. 29, 1992
John L Freeman, Jr, Mesa, AZ (US);
Clarence J Tracy, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A planarized multi-layer metal bonding pad. A first metal bonding pad layer (13) that defines a metal bonding pad is provided. A first dielectric layer (14) is provided with a multitude of vias (17) that covers the first metal bonding pad layer (13), thereby exposing portions of the first metal bonding pad layer (13) through the multitude of vias (17) in the first dielectric (14). A second metal bonding pad layer (18) that further defines the metal bonding pad is deposited on the first dielectric layer (14) making electrical contact to the first metal bonding pad layer through the multitude of vias (17). Planarization of the second metal bonding pad layer (18) is achieved by having the second metal bonding pad layer (18) cover the first dielectric layer (14) and making contact through the vias (17).