The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 1994

Filed:

Mar. 25, 1992
Applicant:
Inventor:

Hong Li, Cambridge, MA (US);

Assignee:

Panasonic Technologies, Inc., Cambridge, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; H01R / ; B23H / ;
U.S. Cl.
CPC ...
219 6915 ; 295272 ; 29825 ; 29885 ; 156D / ; 156D / ; 204289 ; 204292 ; 204293 ; 219 6917 ; 2191212 ; 21912169 ;
Abstract

A method of manufacturing a multiple microelectrode assembly is disclosed. Micromachining technology (such as micro-electrical-discharge machining technology, laser-beam micromachining, electron-beam micromachining) is used to manufacture an electrode/base assembly. The electrode/base assembly is placed within a container; a liquid material is placed into the container; the liquid material surrounds the electrodes of the electrode/base assembly and is allowed to solidify; and the solidified liquid material in combination with the electrode/base assembly is separated from the container. The bottom (or base) portion of the electrode/base assembly is then removed. The electrodes of the electrode/base assembly comprise a plurality of rod-like members of very small (on the order of 1 micron) metallic members of preselected dimension, shape and spacing, by which they are adapted in combination with the surrounding insulating material as a multiple microelectrode assembly.


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