The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 1994
Filed:
Dec. 15, 1992
Hironobu Shinohara, Machida, JP;
Japan Synthetic Rubber Co., Ltd., Tokyo, JP;
Abstract
Semiconductor chips are packaged by injection molding while continuously feeding a lead frame, characterized by using for the injection molding a hydrogenated polymer (A) obtained by the hydrogenation of a polymer obtained by ring-opening polymerization of a specific norbornene derivative or a monomer mixture comprising said norbornene derivative and other monomer copolymerizable therewith, wherein said injection molding for the packaging is carried out under the conditions of a resin temperature in the range of 280.degree. C. to 360.degree. C.; the molding temperature in the range of Tg -80.degree. C. to Tg +10.degree. C., wherein Tg is the glass transition temperature of the hydrogenated polymer (A) is Tg; and the injection pressure in the range of 10 to 200 kgf/cm.sup.2.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile