The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 1994
Filed:
Mar. 08, 1993
Nobuo Iijima, Kawasaki, JP;
Akihisa Hayashida, Kawasaki, JP;
Fujitsu Limited, Kanagawa, JP;
Abstract
A tape-on-wafer mounting apparatus and method for mounting a dicing tape on a wafer. The wafer stage mounts a wafer in the hole, which is constructed such that, when the wafer is mounted there, the wafer top surface stands higher than the wafer stage surface, with the wafer surface on which chip circuits are fabricated faced down. The tape stage mounts a dicing tape on its ring with the tape surface on which adhesives are applied faced down. The tape pressing tool presses the tape stage on the wafer stage so that the tape presser, which is constructed such that vertical force exerted by it is the largest at its center and smaller with the increase in distance from the center, causes the dicing tape to stick to the wafer.