The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 1994

Filed:

Dec. 01, 1992
Applicant:
Inventor:

Hiroaki Takuma, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S / ;
U.S. Cl.
CPC ...
372 36 ;
Abstract

The present invention provides a semiconductor device wherein a semiconductor chip is fixed on a mount body without a short circuit. A positive electrode (42) is provided above a conductive substrate through an insulating layer (38). The electrode (42) have a concavity (43). A bonding connector consists a first bonding connector (70) on the electrode (42) and a second bonding connector (71) around the first bonding connector (70), the first bonding connector being more fluid than the second bonding connector at a certain temperature. A LASER chip (30) is fixed on the second bonding connector (71).


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