Apparatus for loading and unloading thin integrated circuits into and

Abstract

Carriers of a type, each with two elastically bendable holding pieces extending inwardly from its frame-like housing to hold a thin integrated circuit (IC) therebetween, are delivered to a specified pick-up location. A robotically operated pick-up module has a frame-like structure with windows, admits these carriers individually into these windows, and clamps them within these windows by means of an actuator-controlled clamping member. After they are brought to a transfer station having seats with openings connected to a negative pressure source, their holding pieces are pushed apart by activating another actuator within the module so as to move claw-like unlatching members. The ICs, which are then placed on the seats of the transfer station and released from their carriers, are picked up by vacuum suction pipes connected to vacuum pumps. While these ICs are suspended at bottom openings of these suction pipes, the module is robotically taken to a specified discharge location where the carriers, which are now empty, are released from their clamped conditions as the actuator-controlled clamping member is retracted. The ICs are thereafter brought to their desired positions and dropped off from the bottom openings of the suction pipes. By a reverse process and with the help of a device for precisely positioning the ICs, the same apparatus may be used for robotically loading ICs into carriers.