The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 1994

Filed:

Jun. 02, 1993
Applicant:
Inventor:

Lawrence A Wan, Malibu, CA (US);

Assignee:

Bei Electronics, Inc., Sylmar, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P / ;
U.S. Cl.
CPC ...
73505 ; 73510 ;
Abstract

A silicon chip is micromachined so that a plurality of tines extend radially and coplanarly from an outer peripheral surface of a circular base. First and second mounting members extend from the base for mounting the base to a support. The first mounting member is disposed generally perpendicularly to the second mounting member. A pulse generator applies electrostatic or electromagnetic pulses to successive free ends of the plurality of tines so that each tine momentarily vibrates in the plane in rotational sequence along the circumference of the base. The successive vibrations establish a net angular momentum approximating a spinning wheel so that rotation of the sensor about the axis of one of the first or second mounting members causes the other mounting member to experience a deformation due to coriolus force. A plurality of strain gages interconnected to form wheatstone bridges are disposed on the first and second mounting members for respectively sensing deformation of the first and second mounting members in a push-pull manner. The output signals from the strain gages provide an indication of the amount of angular motion. A linear accelerometer may be combined on the same silicon chip, and three such chips may be combined to create an inertial measurement unit that senses rotation and linear acceleration relative to three axes.


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