The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 1994
Filed:
May. 31, 1991
Applicant:
Inventors:
Paul E Schroeder, Chippewa Falls, WI (US);
Deanna M Dowdle, Bloomer, WI (US);
Assignee:
Cray Research, Inc., Eagan, MN (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ; H01K / ;
U.S. Cl.
CPC ...
29843 ; 29852 ;
Abstract
A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a height substantially greater than prior art bumps, while remaining structurally intact. The interconnect bumps are formed using standard photolithography techniques to form the bumps in multiple interlocking portions to achieve a structurally superior interconnect bump.