The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 1994
Filed:
Sep. 27, 1991
Applicant:
Inventor:
Kazunori Hayashi, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257667 ; 257670 ; 257692 ; 257696 ;
Abstract
A lead frame for a semiconductor device provided with package suspension leads that have one end portion connected to an outer frame and that have the side of the other end portion extending into a resin encapsulation region, and island suspension leads that have one end portion connected to the side portion of the island that does not oppose the outer frame, and another end portion extending and connected to the outer frame in the direction of the side of the island so that a region of a depressed portion is obtained.