The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 1994
Filed:
May. 20, 1993
Applicant:
Inventor:
Takashi Murase, Yokohama, JP;
Assignee:
The Furukawa Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257714 ; 257715 ; 257717 ; 165 804 ; 16510433 ; 165185 ; 361689 ; 361699 ; 174 152 ;
Abstract
An electrically insulated heat pipe type cooling apparatus for a semiconductor comprising a heat absorption section for cooling a semiconductor, a heat dissipation section and an intermediate electrical insulation section. This apparatus is capable of highly improving cooling efficiency for a semiconductor and exhibiting satisfactory electrical insulation.