The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 1994

Filed:

Jul. 23, 1991
Applicant:
Inventors:

Naoto Ogasawara, Saitama, JP;

Kenji Kurimura, Tokyo, JP;

Ken-ichi Yoshioka, Tokyo, JP;

Shigeru Saito, Saitama, JP;

Takao Kasai, Saitama, JP;

Masami Hoshi, Tokyo, JP;

Seiichi Nakamura, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
419 58 ; 419 28 ; 419 29 ; 419 38 ; 419 36 ; 419 37 ; 419 53 ; 419 57 ;
Abstract

A process for producing a precision metal part of a sintered body by powder molding comprises using a metal powder of which the oxygen content and the hydrogen reduction loss are controlled to 0.5-6 wt. % and 1-7 wt. %, respectively. The sintered body has a high density near the theoretical density and is excellent in dimensional accuracy. The molding is facilitated, and the process is simple.


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