The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 1994

Filed:

Jun. 21, 1993
Applicant:
Inventors:

Gaylord L Francis, Painted Post, NY (US);

Robert Morena, Caton, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
501 15 ; 501 17 ; 501 18 ; 501 19 ; 501 45 ; 501 46 ; 501 48 ;
Abstract

Lead-free, tin phosphate glasses contain 25-50 mole percent P.sub.2 O.sub.5, 30-70% SnO, 0-15% ZnO, the mole ratio of SnO:ZnO being greater than 5:1, and an effective amount up to 25% total of at least one oxide in the indicated proportion selected from the group consisting of up to 25% R.sub.2 O, wherein R.sub.2 O consists of 0-25% Li.sub.2 O, 0-25% Na.sub.2 O, and 0-25% K.sub.2 O, up to 20% B.sub.2 O.sub.3, up to 5% Al.sub.2 O.sub.3, up to 5% SiO.sub.2, and up to 5% WO.sub.3. The glasses are particularly useful as sealing glass frits in sealing material to join component parts in electrical and electronic devices. The sealing glass material may contain mill additions to reduce the effective coefficient of thermal expansion in a seal, as well as a strength reinforcing additive having a coefficient of thermal expansion preferably below 120.times.10.sup.-7 /.degree.C.


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