The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 1994

Filed:

Mar. 25, 1992
Applicant:
Inventors:

Hisanori Hayashi, Kawasaki, JP;

Hirofumi Kamitakahara, Yokohama, JP;

Naoki Kushida, Yokohama, JP;

Hitoshi Yoshino, Kawasaki, JP;

Osamu Kanome, Yokohama, JP;

Tetsuya Sato, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264-13 ; 264-14 ; 264-25 ; 264571 ; 264102 ; 264106 ; 264220 ; 264D / ; 264334 ; 425810 ;
Abstract

A process for producing a resin molding having a concave-convex pattern on the surface includes the steps of providing an original die having a concave-convex pattern on the surface and a substrate having a flat surface, thereby counterposing the concave-convex pattern surface and the flat surface to each other through a spacer and forming a cell with a cavity formed by the original die, the substrate and the spacer; making an internal pressure of the cell cavity lower than an external pressure thereof, thereby filling at least one of a liquid polymerizable component and a liquid resin into the cavity due to a pressure difference between the external pressure and the internal pressure; curing at least one of the polymerizable component and the liquid resin in the cavity, thereby making a replica; and peeling the original die from the replica, thereby obtaining a resin molding.


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