The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 1994

Filed:

Oct. 13, 1992
Applicant:
Inventors:

Hajime Nishihara, Kanagawa, JP;

Katsuaki Maeda, Kanagawa, JP;

Hiroaki Ishikawa, Kanagawa, JP;

Hiroshi Mikami, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08L / ;
U.S. Cl.
CPC ...
524141 ; 524145 ; 558162 ; 558211 ; 2524002 ;
Abstract

A flow modifier for a thermoplastic resin, which is a hydroxyphenyl-containing organophosphorus compound represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents a hydroxyl group, ##STR2## a hydrogen atom, or an alkyl group having 1 to 6 carbon atoms; a, b, c, and d each represents an integer of from 1 to 3; n represents 0 or an integer of from 1 to 3; when n is 0 or 1, the compound contains one hydroxyl group or ##STR3## group per molecule; and when n is 2 or 3, the compound contains one or two, in total, of hydroxyl group and ##STR4## group per molecule and thermoplastic resin composition containing the flow modifier is disclosed.


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