The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 1994
Filed:
Apr. 22, 1992
Toshio Hatsuda, Ibaraki, JP;
Takahiro Daikoku, Ushiku, JP;
Tetsuya Hayashida, Tokyo, JP;
Noriyuki Ashiwake, Tsuchiura, JP;
Fumiyuki Kobayashi, Sagamihara, JP;
Keizou Kawamura, Ibaraki, JP;
Sohji Sakata, Ibaraki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.