The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 1994

Filed:

Sep. 02, 1992
Applicant:
Inventors:

Takamitsu Fujimoto, Hyogo, JP;

Satoshi Yanaura, Hyogo, JP;

Atsuko Noda, Hyogo, JP;

Takeji Fujiwara, Hyogo, JP;

Hiroyuki Sato, Hyogo, JP;

Fumiaki Baba, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
333246 ; 257788 ; 257790 ;
Abstract

The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.


Find Patent Forward Citations

Loading…