The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 1993

Filed:

Feb. 28, 1992
Applicant:
Inventors:

Cheng P Wen, Mission Viejo, CA (US);

Chan S Wu, Torrance, CA (US);

Cheng K Pao, Torrance, CA (US);

Assignee:

Hughes Aircraft Company, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F / ;
U.S. Cl.
CPC ...
330295 ; 330311 ; 3301 / ;
Abstract

A microwave monolithic integrated circuit (MMIC) (40), includes a substrate (60), and an input bus (62), output bus (64), ground bus (66) and bias bus (68) formed as striplines of a four-line coplanar waveguide on the substrate (60) with the input bus (62) and output bus (64) disposed between the ground bus (66) and bias bus (68). A plurality of spatially distributed cascode amplifier units (43) are formed on the substrate (60), each including an input heterojunction bipolar transistor (HBT) (42) connected in a common-emitter configuration, and an output HBT (44) connected in a common-base configuration. The input HBT (42) has an emitter (E.sub.1) connected to the ground bus (66), a base (B.sub.1) connected to the input bus (62) and a collector (C.sub.1). The output HBT (44) has an emitter (E.sub.2) connected to the collector (C.sub.1) of the input HBT (42), a base (B.sub.2) connected to the bias bus (68) and a collector (C.sub.2) connected to the output bus (64). The distributed amplifier arrangement enables the HBTs (42,44) to operate with balanced electrical parameters and high thermal isolation and heat dissipation.


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