The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1993
Filed:
Jan. 22, 1993
Applicant:
Inventor:
David B Tuckerman, Dublin, CA (US);
Assignee:
nCHIP, Inc., San Jose, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257758 ; 257773 ; 257777 ;
Abstract
A multichip module for interconnecting a plurality of integrated circuits. A thick layer of silicon dioxide, up to 20 .mu.m, serves as a dielectric to separate metal signal layers from power and ground planes The silicon dioxide layer is deposited to have a residual compressive stress of less than 2.times.10.sup.9 dynes/cm.sup.2, and preferably less than 1.times.10.sup.9 dynes/cm.sup.2, to prevent cracking.