The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1993
Filed:
May. 19, 1992
John J Ashman, Huntingdon, PA (US);
Frank C Youngfleish, Penna. Furnace, PA (US);
Elco Corporation, Huntingdon, PA (US);
Abstract
A pad array socket for use in mechanically and electrically connecting a high density pad array integrated circuit carrier to a printed circuit substrate. The socket comprises a flexible circuit, a molded elastomeric spring member, a frame, and a cover. The frame defines a cavity. The elastomeric spring member is placed at the bottom of the cavity. The flexible circuit is placed directly over the elastomeric spring member. An integrated circuit carrier is placed into the cavity upon the flexible circuit. The cover is then secured over the assembly, thereby applying downward pressure on the integrated circuit carrier. The spring member applies upward pressure to the flexible circuit, thereby causing the electrical contacts of the flexible circuit to come into contact with the electrical contacts of the integrated circuit carrier. The flexible circuit includes leads that extend from the socket and which may be soldered to the substrate, thereby mechanically securing the socket to the substrate and providing electrical contact between the socket and the substrate.