The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 1993

Filed:

Mar. 11, 1993
Applicant:
Inventors:

Stanley R Szerlip, Longmont, CO (US);

Floyd G Paurus, Boulder, CO (US);

Assignee:

Storage Technology Corporation, Louisville, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ;
U.S. Cl.
CPC ...
439 66 ; 439485 ; 439591 ; 439487 ;
Abstract

A multi-chip module electrical and thermal conducting apparatus is provided. The apparatus is disposed between layers or boards of the module and includes electrical conducting traces. Electrical conductors are deposited on the faces of the layers and the traces electrically interconnect the electrical conductors of the two layers. The traces are joined to an elastomeric body and insulating material that are essentially non-conductive of electrical and thermal energy. The apparatus includes a thermal conduction unit that acts as a thermal shunt around the body and insulating material. The thermal conduction unit is electrically isolated from the traces. Thermal energy is received by the thermal conduction unit when heat is generated by the activation of electronic components mounted on the module layers. The thermal energy received by the thermal conduction unit is carried away by thermal vias formed in the module layers.


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