The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 1993
Filed:
May. 29, 1992
Kazuhide Koyama, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method of forming wirings which comprises depositing an Al or Al alloy wiring material to a predetermined thickness on a semiconductor substrate having a stepped dent such as a connection hole thereby filling and flattening the dent, then etching back the Al or Al alloy film to leave a portion to a predetermined thickness in the direction of the thickness, and a stop of patterning the thus left Al or Al alloy wiring material in desired wiring shape. Filling and flattening for the dent of the semiconductor substrate can be attained without causing trouble for the subsequent flattening of the inter-layer film, while preventing the reduction of the Al grain size of the Al or Al alloy film and preventing reduction of the electromigration resistance.