The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 1993

Filed:

Jul. 23, 1991
Applicant:
Inventors:

Shinobu Takahama, Fukuoka, JP;

Kunitaka Kamishima, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428209 ; 428901 ;
Abstract

In manufacturing an insulation substrate used in a semiconductor device, a metal plate (10) having relatively thick body portions (11a, 11b, 11c) and relatively thin linkage portions (12,13) is prepared. The body portions are spaced from each other and the linkage portions link up the respective body portions. The metal plate is fixed to a metal flat plate (1) through a resin layer (2). The linkage portions are then removed through selective etching. The structure thus obtained is cut into a plurality of unit structures, to thereby obtain an in insulation substrate having conductive circuit patterns thereon.


Find Patent Forward Citations

Takahama, Shinobu. (1993). Method of manufacturing insulation substrate for semiconductor device (U.S. Patent No. 5271993). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5271993

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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