The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1993
Filed:
Jun. 24, 1992
Tadakatsu Nakajima, Ibaraki, JP;
Shigeo Ohashi, Tsuchiura, JP;
Heikichi Kuwahara, Ibaraki, JP;
Noriyuki Ashiwake, Tsuchiura, JP;
Motohiro Sato, Ibaraki, JP;
Toshio Hatsuda, Ibaraki, JP;
Takahiro Daikoku, Ushiku, JP;
Toshio Hatada, Tsuchiura, JP;
Shigeyuki Sasaki, Ibaraki, JP;
Hiroshi Inouye, Ibaraki, JP;
Atsuo Nishihara, Ibaraki, JP;
Kenichi Kasai, Hadano, JP;
Hitachi, Ltd., , JP;
Abstract
A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.