The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1993

Filed:

Nov. 05, 1992
Applicant:
Inventors:

Enrique Garcia, Sandy Hook, CT (US);

Richard Poole, Norwalk, CT (US);

William America, Newtown, CT (US);

Assignee:

Hughes Aircraft Company, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437-2 ; 437-5 ; 437 53 ; 437974 ; 148D / ;
Abstract

A method for fabricating thinned, back-illuminated, solid state image sensors 10 includes steps of positively doping a bottom surface 22 of a top semiconductor wafer 24, and bonding the bottom surface 22 of the top semiconductor wafer 24 to a top surface 26 of a bottom semiconductor wafer 28 with a silicon dioxide passivation layer 34 in between. The top wafer 24 is thinned and an insulating layer of silicon dioxide 36 and a polysilicon gate structure 38 are formed thereover. Individual dies 40 are then formed, which are bonded to a substrate 42 along each pixel face. The bottom semiconductor wafer layer 28 is etched away to expose the silicon dioxide passivation layer 34, which acts to protect the thinned top wafer layer 24. The dies 40 are then etched to expose bonding pads within the gate structure 38, and sized to create thinned, back-illuminated, solid state image sensors 10.


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