The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1993
Filed:
Jun. 16, 1992
Applicant:
Inventors:
Jing-Pin Pan, Hsinchu, TW;
Tsung-Hsiung Wang, Taichung Hsien, TW;
Shing-Yaw Hsu, Taichung Hsien, TW;
Tzong-Ming Lee, Tainan, TW;
Syh-Ming Ho, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08G / ;
U.S. Cl.
CPC ...
525422 ; 525423 ; 525530 ; 524879 ; 528102 ; 528114 ; 528117 ; 528322 ;
Abstract
A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.