The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1993
Filed:
Jul. 26, 1991
Mikio Kitahara, Yokohama, JP;
Koichi Machida, Kanagawa, JP;
Takayuki Kubo, Kanagawa, JP;
Motoyuki Torikai, Kanagawa, JP;
Koutarou Asahina, Kanagawa, JP;
Junsuke Tanaka, Kanagawa, JP;
Akihiro Yamaguchi, Kanagawa, JP;
Mitsui Toatsu Chemicals, Incorporated, Tokyo, JP;
Abstract
A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.