The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1993
Filed:
Nov. 13, 1992
Norbert Niessner, Friedelsheim, DE;
Klaus Muehlbach, Gruenstadt, DE;
Friedrich Seitz, Friedelsheim, DE;
BASF Aktiengesellschaft, Ludwigshafen, DE;
Abstract
A thermoplastic molding material which is made up of components A, B, C, and D. Component A comprises 10-90% of the composition and is a copolymer made up of 30-95% styrene; 4-40% (meth)acrylonitrile, methyl methacrylate, or maleic anhydride; 1-30% of a monomer described by formula in the specification, N-vinylimidazole or N-vinylcarbazole; and up to 40% of a copolymerizable ethylenically unsaturated monomer. Component B comprises 10-90% of the composition and is a copolymer made up of 50-99.9% of an alpha-olefin; 0.1-50% of a monomer containing acid groups; and up to 40% of a copolymerizable ethylenically unsaturated monomer. Component C comprises up to 80% of the composition and is a copolymer made up of 50-95% styrene and 5-50% (meth)acrylonitrile, methyl methacrylate or maleic anhydride. Component D comprises up to 80% of the composition and is made up of a polycarbonate. All percentages are by weight.