The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1993
Filed:
Jun. 02, 1992
Guy E Lichtenwalter, San Jose, CA (US);
Edward C Miller, Los Gatos, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
Radio frequency emissions within a computer system having a printed circuit assembly in proximity of a metal surface are reduced by the placement of one or more lossy components electrically connected to a metal plane within the printed circuit assembly. A connector electrically connects the lossy components to the metal surface. In one embodiment, the lossy components include two resistors at opposite ends of an edge of the printed circuit assembly that is closest to the metal surface. In an alternate embodiment, a single lossy component is a resistor placed in the middle of an edge of the printed circuit assembly that is closest to the metal surface. In the alternate embodiment, a second connector at a first end of the edge of the printed circuit assembly that is closest to the metal surface directly connects the metal plane to the metal surface, and a third connector at a second end of the edge of the printed circuit assembly that is closest to the metal surface directly connects the metal plane to the metal surface. A spring is used to connect the printed circuit assembly to the metal surface. Ends of the spring are inserted into vias within the printed circuit assembly. Traces on the printed circuit assembly electrically connect the vias to the lossy component. Similarly, the vias may be directly connected to a ground or power plane without an intervening lossy component.