The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1993
Filed:
Oct. 22, 1992
Applicant:
Inventors:
Frank J Juskey, Coral Springs, FL (US);
Anthony B Suppelsa, Coral Springs, FL (US);
Dale W Dorinski, Coral Springs, FL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
156214 ; 29848 ; 29849 ; 29850 ; 156221 ; 1562728 ; 1562735 ; 1562755 ; 1563071 ; 264 22 ; 264 25 ; 264236 ; 26427217 ; 264308 ; 264322 ; 427 96 ; 427 98 ; 4273935 ; 427446 ; 427493 ; 427508 ; 427510 ; 427512 ; 427521 ; 427553 ; 427554 ; 427581 ; 437230 ;
Abstract
A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.