The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 1993

Filed:

Mar. 30, 1992
Applicant:
Inventors:

Gary J Jacaruso, Milford, CT (US);

Geoffrey C Davis, Madison, CT (US);

Allen J McIntire, Ansonia, CT (US);

Assignee:

United Technologies Corporation, Hartford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156148 ; 156280 ; 156298 ; 1563096 ; 156178 ; 428246 ; 428286 ;
Abstract

A pair of thermoset composite structures (19,19') are bonded together by a pair of adhesive strips (10,10'). An adhesive strip (10) is comprised of a layer of semi-crystalline thermoplastic material (12), a layer of amorphous thermoplastic material (14), a layer of dry fiber reinforcement (16) partially embedded in the layer of amorphous thermoplastic material (14), and a layer of thermosetting resin (18) covering the exposed fibers of the dry fiber reinforcement. An adhesive strip is bonded to the bonding surface (20) of the structure (19) during the curing process for the thermoset composite structure. A resistance heating element is placed between the bonding surfaces (20,20'), the bonding surfaces (20,20') are pressed together, and electrical energy is passed through the heating element (24) to heat the joint and fuse the thermoplastic adhesive layers together. The dry fiber reinforcement (16) forms a mechanical lock between the cumulative layer of thermoplastic adhesive (32) and the thermosetting structures (19,19') to provide the bond strength.


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