The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1993
Filed:
Dec. 02, 1991
Risaburo Yoshida, Higashimurayama, JP;
Akira Muraki, Ina, JP;
Yasuhiro Sakuma, Shiroishi, JP;
Masahiro Itoh, Oomiya, JP;
Toppan Printing Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing a multi-layered wiring board, which is characterized in that the oxidation of a wiring layer for roughening the surface of the layer is performed by two steps (a) oxidizing a wiring layer of inner circuit plate with a first alkaline oxidizing solution thereby forming a first oxidized film comprising CuO and Cu.sub.2 O, then etching said first oxidized film to obtain a thinned first oxidized film, and (b) oxidizing said thinned first oxidized film with a second alkaline oxidizing solution thereby forming a second oxidized film enriched with Cu.sub.2 O.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile