The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1993
Filed:
May. 12, 1992
Sheik Abdul-Cader Zahir, Oberwil, CH;
Cecile Pasquier, Semsales, CH;
Wolfgang Scharf, Grenzach-Wyhlen, DE;
Maurice Dupre, Marly, CH;
Ciga-Geigy Corporation, Ardsley, NY (US);
Abstract
Mixtures essentially comprising compounds of formula I or II ##STR1## wherein X is a hydrogen atom or vinyl, A is a divalent aromatic radical which is unsubstituted or substituted by one or more C.sub.1 -C.sub.20 alkyl groups, halogen atoms or halogen-substituted C.sub.1 -C.sub.20 alkyl groups, R.sub.1, R.sub.1 ', R.sub.2, R.sub.2 ', R.sub.3 and R.sub.3 ' are each a hydrogen atom, or R.sub.1 and R.sub.1 ', R.sub.2 and R.sub.2 ' and R.sub.3 and R.sub.3 ' are each together ethylene, R.sub.4 is C.sub.1 -C.sub.6 alkyl, phenylalkyl containing 1 to 6 carbon atoms in the alkyl moiety or is trialkylsilyl containing 1 to 6 carbon atoms in each alkyl moiety, m is 0, 1 or 2, n is 0 or an average number from 1 to 200, p is an average number from 1 to 100 and q is 0 or an average number from 1 to 100, can be cured by heating and are suitable for making laminates, especially for fabricating copper-clad circuit boards.