The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1993
Filed:
Jul. 23, 1991
Applicant:
Inventors:
Jean-Marc Bureau, Palaiseau, FR;
Francois Bernard, Les Ulis, FR;
Dominique Broussoux, Marcoussis, FR;
Claude Vergnolle, Limours, FR;
Assignee:
Thomson-CSF, Puteaux, FR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437183 ; 437208 ; 437215 ; 437915 ;
Abstract
The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.