The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 1993

Filed:

May. 30, 1991
Applicant:
Inventors:

Seiichirou Takabayashi, Yamaguchi, JP;

Katsuo Imatani, Yamaguchi, JP;

Kazuaki Mii, Yamaguchi, JP;

Shuji Watakabe, Yamaguchi, JP;

Assignee:

Ube Industries, Ltd., Yamaguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B29C / ;
U.S. Cl.
CPC ...
428215 ; 15624424 ; 156249 ; 428216 ; 428458 ; 4284735 ;
Abstract

An aromatic polyimide film directly laminated with a metal foil and an aromatic polyimide film directly laminated on both sides with a metal foil wherein the polyimide film (substrate) comprises an aromatic polyimide layer-A of 6-200 .mu.m thick whose polyimide is derived from a biphenyltetracarboxylic acid or its derivative and a phenylenediamine and an aromatic polyimide layer-B of 0.2-15 .mu.m thick whose polyimide is derived from an aromatic tetracarboxylic acid or its derivative and an aromatic diamine having plural benzene rings, and the polyimide layer-A has a thickness of not less than 55% of the total thickness of the aromatic polyimide substrate film, the polyimide layer-B is fixed to the polyimide layer-A under the condition that the layer-B cannot be peeled from the layer-A along the interface between these layers-A and -B and the metal foil is directly fixed on the surface of the polyimide layer-B via no adhesive.


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