The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1993
Filed:
Sep. 17, 1991
Hideo Onoe, Aichi, JP;
Kimikazu Ikemoto, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Abstract
A shaping apparatus utilizing liquid pressure includes a base constructed of a single member and including a lower die and a lower clamp which surrounds the lower die and is integral with the lower die, an upper clamp movable in a vertical direction above the lower clamp, and an upper die or punch movable in the vertical direction above the lower die. The upper die has a lower surface with a configuration to which a workpiece to be formed is pressformed. The lower surface of the upper die and the upper surface of the lower die define a cavity filled with liquid except for a small air pocket when the upper die is lowered. When the upper die is lowered, the upper die contacts and deforms the workpiece. At the same time, the liquid is contained under pressure in the cavity and presses the workpiece against the lower surface of the upper die so that the workpiece is formed precisely to the configuration of the lower surface of the upper die by the contained liquid.