The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1993
Filed:
Oct. 19, 1990
Yasufumi Mizuta, Osaka, JP;
Akihiko Kawahara, Osaka, JP;
Kaname Nakatani, Osaka, JP;
Nariaki Tanaka, Osaka, JP;
Mita Industrial Co., Ltd., Osaka, JP;
Abstract
An electrophotographic photosensitive element comprising a photosensitive layer and a surface protective layer on the photosensitive layer, the surface protective layer comprising a thermosetting silicone resin, and a methyl-butyl etherified melamine-formaldehyde resin in an amount of from 0.1 to 30 parts by weight per 100 parts by weight of the non-volatile solid components of the thermosetting silicone resin, an electrophotographic photosensitive element comprising a photosensitive layer and a surface protective layer on the photosensitive layer, the surface protective layer comprising a thermosetting silicone resin, and an acrylic copolymer having an average molecular weight of 6,000 or less in an amount of from 0.1 to 30 parts by weight per 100 parts by weight of the non-volatile solid components of the thermosetting silicone resin, and an electrophotographic photosensitive element comprising a photosensitive layer and a surface protective layer on the photosensitive layer, the surface protective layer containing a thermosetting silicone resin, a methyl etherified melamine-formaldehyde resin and/or a methyl-butyl mixed etherified melamine-formaldehyde resin in an amount of from 0.1 to 50 parts by weight per 100 parts by weight of the non-volatile solid components of the thermosetting silicone resin, and a thermoplastic resin in an amount of from 1 to 11 wt % to a total amount of the non-volatile solid components of the thermosetting silicone resin and the methyl etherified melamine-formaldehyde resin and/or the methyl-butyl mixed etherified melamine-formaldehyde resin.