The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1993
Filed:
Mar. 05, 1993
Applicant:
Inventors:
Kikuo Yamabe, Yokohama, JP;
Katsuya Okumura, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
118725 ; 118724 ; 219390 ;
Abstract
An apparatus for thermally processing semiconductor wafers within a reaction tube in which the wafers are thermally processed in a higher temperature region within the reaction tube. The thermally processed semiconductor waters are moved into a lower temperature region within the reaction tube. The rate of heat radiated from the thermally processed semiconductor waters is reduced in the lower temperature region within the reaction tube.
Quick Actions:
Yamabe, Kikuo. (1993). Method of thermally processing semiconductor wafers and an apparatus (U.S. Patent No. 5259883). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5259883
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