The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 1993
Filed:
Apr. 08, 1992
Peter J John, Rochester, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
A one-step process bonds a manifold to a printhead die and interconnection board located on a heat sinking substrate, encapsulates wire bonds extending from the interconnection board and the printhead die, and seals air gaps between the manifold and printhead die. A through hole is made in the heat sink substrate and communicates with a cavity defined by the manifold. During assembly, the manifold is positioned on top of the substrate containing the printhead die and the interconnection board and retained by pins. An encapsulation fluid is injected from an underside of the substrate through the through hole and into the cavity. Injection is stopped when the fluid flows nearly to the front of the printhead. The process provides encapsulation of wire bonds, sealing of any air gap between the manifold and the printhead along a front face, and enhances structural bonding of the manifold to printhead components.