The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1993
Filed:
Apr. 15, 1992
William R Brasch, Nesconset, NY (US);
LeaRonal, Inc., Freeport, NY (US);
Abstract
A solution for electroplating gold-copper-silver alloys. The solution comprises gold, copper and silver, each in the form of a cyanide complex. The solution further comprises a divalent sulfur compound capable of brightening and leveling the electroplated deposit of the gold-copper-silver alloy. Optionally, a source of cyanide ions such as a free alkali cyanide, is included in the solution. In addition, additives such as surface active agents, buffers and/or conductivity salts may also be included to impart a particular feature or characteristic to the solution. The invention additionally comprises a process for electroplating up to about 20 microns of a gold-copper-silver alloy upon a substrate utilizing these novel solutions. The alloy is deposited upon a substrate which is immersed in the solution, by electroplating at a current density of between about 1 and 15 ASF, a pH of between about 8-11 at a temperature of between about 100.degree.-170.degree. F. for a time sufficient to obtain the desired thickness. Improved brightness results are obtained with the process of the invention by manipulating the electroplating current.