The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1993
Filed:
Mar. 03, 1992
Masaaki Yamanaka, Ibaraki, JP;
Oji Yuka Goseishi Co., Ltd., Tokyo, JP;
Abstract
A method of preparing an in-mold label is described in which a resin film is embossed to form a gravure pattern having from 60 to 200 roll-formed lines per inch. The embossed film is stretched and then coated on its embossed pattern side with a heat-sensitive liquid resinous adhesive in an amount of from 1 to 10 g/m.sup.2 on a dry resin basis. The applied adhesive is then dried to form an adhesive layer on the film. The in-mold label obtained by the present invention is excellent in printing suitability including feeding properties and ink adhesion, has an advantage that die-cutting for producing the label can be conducted at a high efficiency, and is less apt to develop blisters even under a wide range of molding conditions when used in in-mold application.