Interconnect device mounting apparatus for printed circuit boards

Abstract

A pair of surface mountable electrical component interconnect devices are mounted in a back-to-back relationship on opposite side surfaces of a printed circuit board using specially designed elongated fastening structures that longitudinally extend through mounting holes in the circuit board and corresponding openings in the support board portions of the interconnect devices. Each of the fastening structures is of a plastic material and comprises male and female telescopingly engageable longitudinal sections, provided with enlarged head portions, that may be simply snapped together in an axial direction to create a firm locking engagement between annular exterior and interior barb portions respectively formed on the male and female sections. The female sections are also provided with annular exterior barbs which may be snapped through the circuit board mounting holes to hold one of the interconnect devices on the board while the other interconnect device is being attached by snapping the male fastener portions into their associated, in-place female portions. The enlarged heads on the fastener structure sections function to press spaced apart conductor portions of the interconnect devices against electrically conductive contact areas surface mounted on the opposite sides of the printed circuit board.