The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1993
Filed:
Sep. 14, 1992
Applicant:
Inventor:
Richard K Dennis, Etters, PA (US);
Assignee:
Die Tech, Inc., York Haven, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P / ;
U.S. Cl.
CPC ...
29827 ; 29840 ; 174522 ; 174524 ;
Abstract
A lead assembly and method for forming electrical connections between pads on an integrated circuit chip and pads on a circuit board includes small diameter wires adhesively bonded to a supporting tape. The wires may be inwardly fanned to form connections between relatively widely spaced circuit board pads and relatively closely spaced chip pads.
Dennis, Richard. (1993). Method of making an integrated circuit substrate lead assembly (U.S. Patent No. 5253415). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5253415
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile