The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 1993

Filed:

Nov. 12, 1992
Applicant:
Inventors:

Chiaki Sagawa, Tokyo, JP;

Eiji Shimada, Yokohama, JP;

Shingo Okamoto, Fujisawa, JP;

Assignee:

NOF Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
525124 ; 528 45 ; 4284258 ;
Abstract

A powder coating composition comprises 100 weight parts of the total of a polyester resin having a hydroxyl value in the range from 20 to 100 KOH mg/g and a blocked polyisocyanate compound, 0.01 to 3 weight parts of an organotin compound and 0.01 to 10 weight parts of a carboxylic acid compound having an acid value of 1000 KOH mg/g or less which can form a complex compound by reaction with the organotin compound. The amount of the polyester resin is in the range from 95 to 50 weight % and the amount of the blocked polyisocyanate compound is in the range from 5 to 50 weight % respectively based on the total of the polyester resin and the blocked polyisocyanate compound. A precoat steel plate is prepared by coating the powder coating composition described above on a steel plate by a electrostatic powder coating method to form a coating layer having a thickness in the range from 20 to 120 .mu.m and curing the coating composition by baking at a temperature in the range from 190.degree. to 300.degree. C. for a time in the range from 20 seconds to 10 minutes. The powder coating composition can be cured without formation of blisters and pin holes under a desired condition by controlling the rate of the curing reaction.


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