The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 1993

Filed:

Jan. 22, 1992
Applicant:
Inventors:

Shuji Nakata, Toyonaka-Shi, Osaka-Fu, JP;

Minoru Nakamura, Osaka, JP;

Takeo Sakai, Kawagoe, JP;

Yoshimasa Shimizu, Kawagoe, JP;

Yoshihiro Kondo, Kawagoe, JP;

Assignees:

Other;

Denyo Kabushiki Kaisha, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N / ;
U.S. Cl.
CPC ...
250330 ; 250342 ; 2503581 ; 374-5 ; 374124 ;
Abstract

A method and device for checking a joint of an electronic component is arranged to apply heat energy to a joint containing a heat conductive material and receive the infrared ray radiated from said joint with an infrared camera. By processing the image information output from the infrared camera, the method and device can offer an area of a defect, an area ratio of a defect, pixel coordinates, a temperature distribution pattern, a distance between central axes of a particular portion of the joint, or a gradient angle. The obtained value is compared with a predetermined value for determining the kind of a defect and whether or not the joint is defective.


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