The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1993
Filed:
Nov. 15, 1991
Applicant:
Inventor:
Isao Kano, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174262 ; 361808 ;
Abstract
A semiconductor device of a multilayer interconnection structure which includes a plurality of insulating layers and a plurality of metal interconnection layers. The uppermost metal interconnection layer is formed in a hall in the uppermost interlayer insulating layer. The uppermost interconnection layer is formed as a bonding pad portion and a part of the layer is formed into a ring-shaped portion so as to cover the side portion of the hall.