The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 1993

Filed:

Nov. 13, 1992
Applicant:
Inventors:

Robert Miracky, Cedar Park, TX (US);

Joan E Yater, Austin, TX (US);

Colin A Mackay, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; C23C / ; C23C / ; H01L / ;
U.S. Cl.
CPC ...
427556 ; 427553 ; 427584 ; 427250 ; 427253 ; 156634 ; 156656 ; 20419214 ; 20419217 ;
Abstract

A method of depositing micron-sized metal lines on a dielectric substrate, such as polyimide. The dielectric is covered with a thin metallic layer, of a first metal placed in a reaction cell containing a gas-phase molecular species containing a second metal, and exposed to a focused laser beam. A translation stage moves the dielectric relative to the beam to selectively deposit micron-sized second metal lines on the metallic layer. The metallic layer on the unirradiated portion of the substrate is subsequently etched away, leaving the lines adhered to the dielectric surface.


Find Patent Forward Citations

Miracky, Robert. (1993). Method of depositing conductive lines on a dielectric (U.S. Patent No. 5250329). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5250329

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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