The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1993
Filed:
Apr. 24, 1992
Russell M Richman, Chatham, NJ (US);
American Telephone & Telegraph Co., New York, NY (US);
Abstract
A method of making a semiconductor integrated circuit package (20) containing a chip (25)--and/or other active or passive electronic component(s)--enclosed in an encapsulation layer (24) can be made thinner by abandoning the limitation of equality of thicknesses of electrically conductive lead frame fingers (21) and paddle (mounting pad, 22)--the latter of which supports the chip (25) during fabrication of the package prior to encapsulation. As a result, a desired downset d of the paddle (22) with respect to inner portions (21.1) of the conductive fingers (21) automatically occurs without any bending of any die paddle support fingers--the latter of which support the paddle during fabrication of the package. The paddle (22) advantageously is made by preparing a metallic pad sheet having a thickness equal to that of the paddle (22), and then dividing it into a multiplicity of pieces, each of the pieces having a contour such that the piece is suitable for use as the paddle (22).